What it is
A BoosterPack shield that turns a TivaC LaunchPad into a 24 V multi-zone thermal controller for a dry-ice freezer and battery-heater test rig. Six software-switched load ports at 2.5 A each, 15 A board total — every port fused, flyback-protected, and driven through its own power MOSFET.
Sixteen zones, one pin
Sixteen thermistor zones funnel through a 16-channel analog mux into a single ADC pin, and a dedicated thermocouple channel reads down to −78 °C dry ice. The whole design fits on one organized A1 schematic sheet — power entry, load ports, sensing, and headers each in their own titled block.
Designed to fail off
If the MCU is unplugged, rebooting, or crashed, every heater is off — pull-downs on the gate buffer guarantee it, and the buffer runs at 5 V because 3.3 V logic can't fully turn on a power FET. Even reverse-connecting the 24 V supply is survivable: two paralleled P-FETs block it while dissipating a quarter of the heat one would.
| Qty | Part |
|---|---|
| 1 | EK-TM4C123GXL LaunchPad |
| 6 | 60 V logic-level DPAK MOSFET |
| 6 | SS36 Schottky + 4 A mini-blade fuse |
| 2 | SQD50P06-15L P-FET |
| 1 | CD74HC4067M 16-ch analog mux |
| 1 | MAX31856 thermocouple ADC |
| 1 | LM2596S-5 buck converter |
| 1 | 74HCT244 gate buffer |
Verified, then ordered
Zero ERC errors, zero DRC violations, a 42/42 pin-map check against a frozen source of truth, the thermocouple pair length-matched to 0.0000 mm, and every gate-drive trace on a single layer with no vias. The full JLCPCB production package shipped in July 2026: 4-layer ENIG, 83 machine-placed parts, 43 hand-solderable through-hole. The next revision — already in layout — moves the TM4C123 chip onto the board itself.